Insituform
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Insituform Technologies, Inc. is a worldwide provider of trenchless technologies for gravity and pressure pipelines. Insituform is a subsidiary of Aegion Corporation. (NASD: AEGN).
Insituform's inception was prompted by the invention of cured-in-place pipe (CIPP) by Eric Wood of the United Kingdom in the early 1970s. Its name comes from the Latin phrase "in situ form," which means to "form in place." The first CIPP tube was installed in the UK in 1971 and is still in service today. A CIPP system consists of a flexible felt or fiber-reinforced tube impregnated with resin. The tube is inserted into an existing pipeline by either inversion or via a pull-in method. It is then cured with steam or hot water, providing a new jointless pipe within a pipe.
In 2007, Insituform announced that it would exit the tunneling business and seek a buyer for Affolder, Inc.[1]
Insituform acquired two new companies in first quarter of 2009. The Bayou Companies acquisition closed on February 23, 2009.[2] Acquisition of Corrpro Companies, Inc. closed on March 31, 2009.[3]
In 2011, Aegion Corporation was created to serve as the parent company for Insituform, Bayou and Corrpro, along with other acquisitions.[4] Today, Aegion is the parent company of Insituform along with Aegion Coating Services, The Bayou Companies, Brinderson, Corrpro, Fibrwrap, Fyfe, Underground Solutions and United Pipeline Systems.
References[edit]
- ^ David Schuyler (April 8, 2007). "Deep tunnel contractor to be shut down". Milwaukee Business Journal.
- ^ "Insituform Technologies, Inc. Announces Acquisition of The Bayou Companies". aegion.com. 23 February 2009. Archived from the original on 5 March 2009.
- ^ "Insituform Technologies, Inc. Closes Acquisition of Corrpro Companies". aegion.com. 2009-03-31. Archived from the original on 2009-04-02.
- ^ "Aegion Corporation Formed to Serve as New Parent Holding Company for Insituform Technologies and its Subsidiaries". www.businesswire.com. 2011-10-25. Retrieved 2020-07-12.
External links[edit]
- Official site
- Information on U.S. Patent no. 4009063
- Related information on CIPP patents
- Company information
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